UV 405nm 4W Space Coupling Fiber Laser Module for Laser Direct Imaging

UV 405nm 4W Space Coupling Fiber Laser Module for Laser Direct Imaging The UV 405nm 4W Space-Coupled Fiber Laser Module, a high-performance industrial-grade light source tailored for laser direct imaging (LDI) systems. Integrating 405nm UV lasers’ photoresist absorption optimization, 4W high-power output, space-coupled beam shaping technology, and precision fiber transmission, it delivers uniform, high-energy laser beams for high-resolution patterning, ideal for PCB fine circuit manufacturing, semiconductor packaging, and flexible electronics imaging. Core Advantages 405nm UV Wavelength for LDI Photoresist Compatibility 405nm wavelength aligns precisely with the absorption peak of industrial LDI photoresists, enabling efficient photopolymerization with minimal thermal damage to substrates; supports ultra-fine linewidth patterning for high-density PCB and FPC production, outperforming longer-wavelength lasers in imaging resolution. 4W High Power for High-Throughput LDI Processing Delivers stable CW mode output with lower power fluctuation, providing sufficient energy density for rapid photoresist exposure; reduces LDI processing time by 50% compared to 1-2W modules, meeting the mass production demands of electronic manufacturing lines. Space-Coupled Beam Shaping for Uniform Imaging Adopts advanced space-coupled optical design to generate a flat-top beam profile with ≥90% uniformity; eliminates beam hotspots that cause photoresist overexposure, ensuring consistent patterning quality across large-area substrates for PCB panel imaging. Fiber Transmission & Industrial-Grade Stability It can be equipped with high-purity UV-grade silica fiber (core diameter 105um/150μm, NA=0.22, coupling efficiency ≥85%); enables flexible beam delivery to LDI scanning systems, avoiding mechanical alignment errors. Key Applications Perfect for laser direct imaging (LDI) in PCB fine circuit patterning, semiconductor packaging lithography, flexible printed circuit (FPC) imaging, and advanced packaging (fan-out wafer level packaging) processes; also applicable to high-precision photomask making and microfluidic chip fabrication. Core Specification : Wavelength 405nm Output Power 4W(CW) Working Voltage 19-24V Fiber Core Diameter 105um Coupling Efficiency 85%  Housing Size 53.8*25*16mm (Customizable) Lifespan  10,000 hours Product Display :     Our Services : We have over 15 years of experience with Lasers. We offer professional OEM& ODM service for laser modules from 375nm to 1064nm! Item Parameter Wavelength 375-405nm 425-488nm 515-520nm 635-670nm 780-980nm Single Diode  Module Optical Power 20mW-3W 20mW-3W 10mW-1.6W 5mW-2.5W 5mW-75W Multi Diodes Module Optical Power 3W-200W 6W-500W 1.6W-50W 2.5W-30W 75W-100W Operating Voltage 3-5V/6V/ 12V/ 24V/ 30V/ 110V/ 220V/ 240V etc. Beam Mode Dot/ Line/ Cross/ Grid/ Muti-lines/ DOE etc. Fan Angle Options of the Line Beam 5°/10°/15°/20°/25°/30°/45°/60°/90°/110°/130°/180° etc. Optical Lens Acrylic lenses, glass lenses, wave lenses, Powell lenses etc. Dimension 4*8mm/ 6*10.5mm/12*15mm/9*21mm/16*66mm/ 33*33*55mm/ Customizable etc. CDRH Class class1/class2/class3R/class3B/class4