Latest versions of Duma’s M² Laser Beam Propagation Analyzer offers the maximum flexibility and superior capabilities of measurement of pulsed or CW beams, from UV to wavelengths over 1.6 microns. Two versions are offered: 1) Multi-axis knife edge scanning sensor with folded cavity. 2) Camera based sensor using a similar folded cavity. Specially designed for pulsed lasers or CW beams. Beam sizes up to 25 mm Wavelengths up to 2.7 microns Determination of M², waist location and waist diameter. Low & high power laser beams measurement. Up to 4 kWatts. In accordance with latest relevant ISO standards. Measurements: Beam Propagation (M²) Beam Waist Location Beam Waist Diameter Divergence Rayleigh Range Waist Asymmetry Astigmatism Specifications Input Beam Measuring Method Knife-edge -7 blades mounted on a rotating drum Measuring Parameters Beam size,Power,3-D Reconstruction Beam Propagation Parameters BPP over up to 50mm range ,M2 and depth of focus Optional ND filters according to application Scaning Assembly Attachment Scaning Assembly Attachment Spectral Range 350nm to 1100nm(Si version) Beam Power Range 100W~8000W with supplied internal filter(Si version) Continuous Operating Duration-Limited to 10 seconds Number of Knife-edges 7 Beam size and max.power density at entrance: Input diameter 8mm max Power densitiy at input aperture 0.4kW/mm2 Minimal work distance for focused beams 100mm distance between input aperture to measuring plane of sensor head closest location Ordering Information M2Beam-Si – measurement device for silicon range (350 – 1100nm) M2Beam-UV – measurement device for silicon range (190 – 1100nm) M2Beam-IR – measurement device for silicon range (800 – 1800nm) M2Beam-U3-VIS-NIR – measurement device for 350-1600 nm CMOS based M2Beam-UV-NIR – Special – consult factory. SAM3-HP-M – beam sampler for high power beams
